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LEAD-FREE COURSES
Professional Development Webinar Series:
Lead-free System Reliability
Prinicpleand Practice.
Featuring Dr. Jennie Hwang
On the tenth anniversary of lead-free implementation in the electronics industry, this webinar series provides a holistic coverage of lead-free reliability by presenting historical product performance, as well as forward looking assessments in future performance requirements. The test results are extended with the substantiation of scientific principles. The series is suitable for both novice and experienced professionals who have a focus either on empirical data in practice or scientific basis in principle.
- Webinar Info
- About Dr. Jennie Hwang
Choose only the webinar sessions you need - or register for all remaining sessions for 10% off!
Each session may be attended independently. All information for each webinar topic will be fully covered during the session.
Each webinar is 50 minutes of live audio lecture from Dr. Hwang with accompanying visual presentation. After the lecture, there will be a Q&A session for any questions you may have for Dr. Hwang.
PC and MAC compatible - we use GoToWebinar Technology. Buy now online instantly!
Pb - System Reliablility - General Key Areas Recorded 1-13-2010
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Topics Covered Include :
Introduction
Global RoHs status update - EU, China, Korea, others
Reliablility Definition
Product Philosiphy - Reliablility vs. qualification
System Reliablility
Distinctions Between Pb-free and SnPb Solder Joints
Commonalities Between Pb-free and SnPb Solder Joints
Cost Factor
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$75
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.wmv Format, Running Time : 1 hour 8 minutes.
About Dr. Jennie Hwang
Dr. Hwang, a pioneer and long-standing leader in lead-free electronics, brings her 30-year manufacturing experience combined with her sustained 20-year lead-free R&D and hands-on production implementation to this lecture. She has been a major contributor to the implementation of Surface Mount production since its inception through hands-on operation and as an advisor to OEMs, EMS and U.S. government. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications including U.S. Dept. of Defense F-22 program. Among her many awards and honors are citations by the U.S. Congress, Honorary Doctoral degree, induction into WITI International Hall of Fame, named "R&D Star-to-Watch" by Industry Week; YWCA Women of Achievement Award; election to the National Academy of Engineering. She holds patents and has 300+ publications to her credit, including the sole authorship of several internationally-used textbooks related to electronic packaging and assembly. Her books, columns, and publications have been widely cited worldwide. Dr. Hwang has been a frequent keynote/featured speaker at worldwide events (United States Patent and Trademark Office, Federal Womens Program, numerous industry events). Over the years, she has lectured to more than 28,000 professionals and researchers in professional development courses. Her formal education includes Harvard Business School Executive Program and Ph.D. M.S., M.S., B.S. degrees in Materials & Metallurgical Engineering, Inorganic Chemistry, Liquid Crystals Science and Chemistry, respectively. She has held various senior executive positions with Lockheed Martin, SCM Corp, Sherwin Williams Co, and IEM Corp. She is currently a principal of H-Technologies Group, providing business and manufacturing solutions to the electronics industry. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the Universitys Board of Trustees. Her books have received a wide circulation worldwide:
- # (ISBN-0-07-143048-2) “Lead-free Implementation: A Guide to Manufacturing” McGraw-Hill, New York, 2005
- # (ISBN-0 901 150 401) “Environment-Friendly Electronics—Lead Free Technology”, Electrochemical Publications, LTD, Great Britain, 2001
- # (ISBN-0-07-031749-3) "Modern Solder Technology for Competitive Electronics Manufacturing", , McGraw-Hill, New York, 1996
- # (ISBN-0-90-115029-0)"IC Ball Grid Array & Fine Pitch Peripheral Interconnections”, Electrochemical Publications, LTD, Great Britain, 1995
- # In Japanese, "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1989
- # (ISBN-0442-2075-49) "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1988
BONUS for the first 12 participants who register for 2 or more sessions - Free Textbook: “Environment - Friendly Electronics - Lead Free Technology” written by Dr. Jennie Hwang, A value of $299.00!
10% Discount for multiple registrants from the same company - call for details.
Cancellation Terms: This order may be canceled by either party, with written notice, 15 days in advance of scheduled class date. Any order cancelled by the customer outside of these conditions, the customer will be responsible for the full cost of the class. Any order canceled by Blackfox outside of these conditions, full payment will be refunded to the customer. If payment, in full, is not received by Blackfox within the 15 days, an additional 2% per week will be added to total amount due.
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