Darin has been in electronics manufacturing for over 15 years. His experience includes duties involving nearly every step within a production floor. Darin has worked for electronic manufacturing companies including Celestica, NEO Tech, Vergent Products and Lockheed Martin.
In the beginning of his career, Darin operated SMT equipment and preformed PCB repair: Solder Pot Repair, (BGA) Ball Grid Array Repair and Pad and Trace. As an engineering technician and new product technician he facilitated the development and implementation of new production builds, programmed stencil printers, SMT pick and place equipment, AOI equipment and oven profiling. Additionally, he defined new procedures on production lines for operations and special processes by creating, maintaining and updating assembly work instruction for both PCBA and final assembly. Darin holds an Associate of Applied Science degree and other scholar honors and certificates.
Darin is currently a Master IPC Trainer or Certified IPC Trainer in the following standards:
- IPC-J-STD-001 MIT
- IPC-A-610 MIT
- IPC/WHMA-A-620 MIT
- IPC 7711/7721 MIT
- IPC-A-600 CIT
Darin enjoys a relaxed training environment and with his knowledge he can deliver a training experience to which all students will be able to connect to their current position.